handling substrates (Total 106 Patents Found)

A system for sensing, orienting, and transporting wafers in an automated wafer handling process that reduces the generation of particles and contamination so that the wafer yield is increased. The system includes a robotic arm for moving a wafer from one station to a destination station, and an end-effector connected t...
A device for handling substrates, used in an epitaxial apparatus or reactor ( 20 ) for chemical vapour deposition (CVD) onto the said substrates, comprises an internal robot ( 30 ) provided with means ( 60 ) for gripping and transporting substrates, which are in the form of semiconductor slices ( 24 ), in order to tran...
The invention relates to a pneumatic feed and separation system ( 1 ) for flat substrates ( 3 ) such as papers and the like in a stack ( 5, 5′, 5″ ), and to a corresponding method. The system has: a rear edge separating apparatus ( 10 ) for separation of a top substrate ( 3 ) from the stack ( 5, 5′, 5″ ) in the...
Techniques for handling substrates are disclosed. In one particular exemplary embodiment, the techniques may be realized as a substrate support. The substrate support may comprise a mounting portion. The substrate support may also comprise a wall extending from the mounting portion, wherein the wall may form a generall...
A device for particle free handling of substrates of micro technology within mini environments under clean room conditions works friction free and thus particle free. One component of the device is movable relative to an other component in at least the x-, y-, z-axes and a Φ-direction and supported and driven along ea...
A system is provided for sensing, orienting, and transporting wafers in an automated wafer handling process that reduces the generation of particles and contamination so that the wafer yield is increased. The system includes a robotic arm for moving a wafer from one station to a destination station, and an end-effector...
An improved method of and apparatus for producing preferably thin plastic protective film layers for thin shiny copper foils and the like, as for PCB applications, with electric-charge adhering of the same to the foil and with peel-off releasable properties to provide the same original pristine, shiny copper foil surfa...
A material for use as part of an internal resistor within a circuitized substrate includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ceramic component. The ceramic component may be a ferroelectric ceramic and/or a high surface area ceramic and/or...
Apparatus for handling delicate workpieces such as semiconductor substrates which have the configuration of small plates. The workpieces are preliminarily situated at predetermined locations in a positioning plane. Then, without changing their positions relative to each other, the workpieces are all simultaneously tran...
A system for sensing, orienting, and transporting wafers in an automated wafer handling process that reduces the generation of particles and contamination so that the wafer yield is increased. The system includes a robotic arm for moving a wafer from one station to a destination station, and an end-effector connected t...
The amount of particulate contamination produced due to rubbing between a semiconductor substrate and the robotic substrate handling blade has been greatly reduced by the use of specialized materials either as the principal material of construction for the semiconductor substrate handling blade, or as a coating upon th...
The present invention relates to a device for producing electronic assemblies, the device has a logistic module (4) which is formed for transport of the substrate (2); and at least a robot module (10)connected to the logistic module (4) to operate the substrate (2), wherein the robot module (10) may connect and/or disc...
A circuitized substrate in which three conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to two dielectric layers. Each of the foil surfaces which physically bond to a respective dielectric layer are smooth (e.g., preferably by chemical processing) and may include a thin, organic layer th...
Described herein are several embodiments of a handling apparatus for plant growth substrates and associated methods of use. For example, in one embodiment, an apparatus for separately and automatically dispensing plant growth media includes a media guide and a media guide regulator. The media guide can define a channel...
L'invention concerne un support électrostatique permettant de supporter un substrat en vue de sa manipulation à travers différents processus. Le support possède une plaque diélectrique ayant un côté supérieur et un côté inférieur et conçue pour être fixée du côté supérieur de la plaque à un substr...
System and method for handling substrates in a lithography manufacturing process are disclosed. In one embodiment, a system for handling substrates in a lithography manufacturing process includes a plurality of porous chucks positioned above a substrate for imaging, a plurality of pressure sources configured to apply p...
Selon des modes de réalisation, la présente invention porte sur un effecteur pour un robot de manipulation de substrats. Dans un mode de réalisation, l'effecteur comprend un ou plusieurs mandrins de Bernoulli entourés par une pluralité de dispositifs à ventouse. Dans un mode de réalisation, les dispositifs ...
The present teachings relate to a system for handling semiconductor substrates with end effector devices. In one embodiment a plurality of orifices situated on a robot end effector are used to manipulate a highly shaped semiconductor wafer or substrate. The orifices may create vacuum forces on the substrate to enable t...
The device has a chamber for accommodating stacks (18) partially bordered perpendicularly by fixed walls (20). The chamber has a suction device which operates area by area over the stacks for holding or arranging the pressure carriers at the wall by negative pressure. An independent claim is also included for a method ...
An edge gripping device for a robot arm grips and ungrips substrates, such as semiconductor wafers. A base is fixed to an end of the robot arm. A blade, having a distal contact location thereon, and a pusher bar, having preferably two proximal contact locations thereon, are movably mounted to the base via a linkage mec...
A device (10) for handling substrates (11) inside and outside a clean room (15) is provided with a locking transfer device (17), by which means a substrate cassette (12) that is accommodated in a box (13) in clean-room conditions can be removed from or placed in said box (13); and with a first handling device (51), by ...
An improved method of and apparatus for producing preferably thin plastic protective film layers for thin shiny copper foils and the like, as for PCB applications, with electric-charge adhering of the same to the foil and with peel-off releasable properties to provide the same original pristine, shiny copper foil surfa...
In a production line, a cluster tool having a plurality of substantially identical process modules and a metrology tool includes a control unit that allows one to receive, store and process information that indicates in which process module which substrates have been processed and which selects, on the basis of the pro...
An electrostatic carrier is described for carrying a substrate for handling through different processes. The carrier has a dielectric plate having a top side and a bottom side and configured to be attached on a top side of the plate to a substrate using electrostatic force, and a base plate coupled to a bottom side of ...
Flat substrate (16) are transported by a conveyor on a liq. film (15), for travel along its flow. Pref. the liq. film in provided on a surface of a plate (11). The latter may have inclined apertures (12) as liq. passages, with apertures being cylindrical in cross section. Alternately, the apertures are slots, and there...
A material for use as part of an internal capacitor within a circuitized substrate includes a polymer (e.g., a cycloaliphatic epoxy or phenoxy based) resin and a quantity of nano-powders of ferroelectric ceramic material (e.g., barium titanate) having a particle size substantially in the range of from about 0.01 micron...
Disclosed systems and methods for testing a device under test (DUT) with a probe system are selected to test a DUT at a temperature below the dew point of the ambient environment surrounding the probe system. Probe systems include a measurement chamber configured to isolate a cool, dry testing environment and a measure...
An edge gripping device grips and ungrips a substrate, such as a semiconductor wafer. A blade extends in a distal direction from a base of the device. At least one distal contact member is provided at the tip of the blade. Two proximal lever arms are pivotally coupled for synchronized, oppositely directed rotation to t...
An edge gripping device grips and ungrips a substrate, such as a semiconductor wafer. A blade extends in a distal direction from a base of the device. At least one distal contact member is provided at the tip of the blade. Two proximal lever arms are pivotally coupled for synchronized, oppositely directed rotation to t...
An edge gripping device for a robot arm grips and ungrips substrates, such as semiconductor wafers. A base is fixed to an end of the robot arm. A blade, having a distal contact location thereon, and a pusher bar, having preferably two proximal contact locations thereon, are movably mounted to the base via a linkage mec...
A device (10) for handling substrates (11) inside and outside a clean room (15) is provided with a locking transfer device (17), by which means a substrate cassette (12) that is accommodated in a box (13) in clean-room conditions can be removed from or placed in said box (13); and with a first handling device (51), by ...
A device for handling substrates, used in an epitaxial apparatus or reactor (20) for chemical vapour deposition (CVD) onto the said substrates, comprises an internal robot (30) provided with means (60) for gripping and transporting substrates, which are in the form of semiconductor slices (24), in order to transfer the...
An electrostatic carrier is described for carrying a substrate for handling through different processes. The carrier has a dielectric plate having a top side and a bottom side and configured to be attached on a top side of the plate to a substrate using electrostatic force, and a base plate coupled to a bottom side of ...
기판에 화학 증착(CVD)을 위한 에피택셜 장치 또는 반응기(20)에 사용되는 기판 핸들링 장치는 내부 로봇(30)을 포함하며, 내부 로봇(30)은 처리될 반도체 슬라이스(24)들을 수용하는 카세트(38, 40)에서 반도체 슬라이스(24) 형태의 기판을 파지하여 ...
A device ( 10 ) for handling substrates ( 11 ) inside and outside a clean room ( 15 ) is provided with a locking transfer device ( 17 ), by which means a substrate cassette ( 12 ) that is accommodated in a box ( 13 ) in clean-room conditions can be removed from or placed in said box ( 13 ); and with a first handling de...
Embodiments of the present invention provide an end effector for a substrate handling robot. In one embodiment, the end effector comprises one or more Bernoulli chucks surrounded by a plurality of suction cup devices. In one embodiment, the suction cup devices are configured in the form of a bellows to provide both cus...
Die erfindungsgemäße Anordnung zum Herstellen elektronischer Baugruppen umfasst ein Logistikmodul (4) zum Transport von Substraten (2) sowie zumindest ein mit dem Logistikmodul (4) gekoppeltes Robotermodul (10) zum Handhaben der Substrate (2), wobei das Robotermodul (10) während des Betriebes des Logistikmoduls (4) ...
In a production line, a cluster tool having a plurality of substantially identical process modules and a metrology tool comprise a control unit that allows one to receive, store and process information that indicates in which process module which substrates have been processed and which selects, on the basis of the pro...
Disclosed systems and methods for testing a device under test (DUT) with a probe system are selected to test a DUT at a temperature below the dew point of the ambient environment surrounding the probe system. Probe systems include a measurement chamber configured to isolate a cool, dry testing environment and a measure...
Techniques for handling substrates are disclosed. In one particular exemplary embodiment, the techniques may be realized as a substrate support. The substrate support may comprise a mounting portion.The substrate support may also comprise a wall extending from the mounting portion, wherein the wall may form a generally...